Dingsheng Group to share with you the latest industry news
Dingsheng Group to share with you the latest industry news
Board Level Underfills and Adhesives for High Reliability Applications
Effects of Board Level Materials
➢ Improve Drop and Shock Performance of POP’s, BGA’s, CSP’s & WLCSP’s
➢ Affect Thermal Cycle Performance
— High CTE underfill reduces performance
— Low CTE underfill enhances performance
Zymet Solutions:
Underfill, Edgefill & Edgebond
Underfill
Edgefill
Edgebond
Address：Room 804, No. 200. Xinghai Rd, Suzhou City, Jiangsu Province, China
Phone：0512-62567570
0512-62567686
Email：solder@dingshengsz.com